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U1 · IDENTITY

Package: MCU-64 · Family: HUMAN · Rev A

Willow Kim
JUNIOR ECE @ OHIO STATE // SEEKING SUMMER 2027 INTERNSHIP

Hi! I'm an Electrical and Computer Engineering student at The Ohio State University with hands-on experience in RF/analog circuits, wearable sensing systems, embedded firmware, PCB design, and hardware verification.

Through two years of wearable and implantable technology research at the ElectroScience Laboratory (Electrical Designer) and internships at Medtronic (early-stage R&D) and Johnson & Johnson MedTech (late-stage product development), I developed skills in board-level design, early-stage prototyping, signal processing, debugging, VNA/oscilloscope validation, geometry modeling, and regulated technical documentation.

I care about how a product affects the people using it; how it feels in their hands. I originally studied neuroscience, drawn to how the brain operates and what shapes it. That interest pulled me toward technologies that interface with people from the outside. I transitioned into ECE in Fall 2024, and I've been building toward that intersection ever since.

CREDENTIALS
GPA 3.85 / 4.0 B.S. ECE, EXPECTED DEC 2027 HAROLD F. MATHIS MEMORIAL SCHOLAR IN EE STEP FELLOW · $2K RESEARCH FELLOWSHIP (2025) COLLEGE OF ENGINEERING DEPT. AMBASSADOR ELECTROSCIENCE LAB UNDERGRAD RESEARCHER
AREAS OF INTEREST
ROBOTICS MEDTECH CONSUMER HARDWARE PCB DESIGN ANALOG / RF CIRCUITS DIGITAL TWIN / SIMULATION
SKILLS
PCB DESIGN
4-layer layout, schematic capture, RF / impedance-matched routing, EasyEDA & KiCad, 0603 soldering, dev board bring-up
EMBEDDED SYSTEMS
BLE firmware (nRF52840), I²C, SPI, UART, C/C++, Python
ANALOG / RF & SIGNAL PROCESSING
Chebyshev filter design, PPG signal processing (MATLAB), impedance matching
SIMULATION & MODELING
LTspice, parameterized geometry generation, digital twin / biomedical simulation
TEST & MEASUREMENT
VNA (S21), oscilloscope, power supplies
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> EXPERIENCE.chip / die view

U2 · CO-OP + INTERNSHIPS

Contents: 2 sub-components · Interconnect: professional

ACTIVE

MEDTRONIC

R&D ELECTRICAL INTERN · CORONARY RENAL DENERVATION TEAM · SANTA ROSA, CA · JUN – AUG 2026

Supported early-stage medical device R&D through physiological signal processing and computational modeling work. My projects involved processing PPG data, building analysis workflows, and applying statistical methods to characterize signal behavior across experimental conditions.

I developed modeling tools for vascular geometry studies and gained experience with biomedical simulation (digital twin), parameterized geometry generation, and research-oriented engineering workflows.

SKILL PINS
MATLAB SIGNAL PROCESSING PPG DATA COLLECTION LABCHART STATISTICAL ANALYSIS BIOMEDICAL SIMULATION DIGITAL TWIN PARAMETERIZED GEOMETRY EARLY-STAGE R&D
Medtronic
R&D Intern · 2026

JOHNSON & JOHNSON MEDTECH

ELECTRICAL ENGINEERING CO-OP · DUALTO™ SURGICAL ROBOTICS ENERGY SYSTEM · CINCINNATI, OH · JAN – MAY 2026

Worked on the DUALTO™ Surgical Robotics Energy System team, supporting calibration fixture testing, verification, and technical documentation for internal engineering use. I created regulated technical documentation such as operating procedures, software validation documentation, and test case data to support fixture verification. These are formally reviewed and signed through the team's internal document-control process. I conducted failure analysis on the fixture module, successfully identifying issues and debugging the module.

Alongside the fixture work, I had a great opportunity to design a 4-layer ATmega32u4 development board. As my very first dev board design experience, I learned the whole board design workflow in KiCad. I constructed a design plan within a set time frame, including block diagram development, schematic design, PCB layout, component research and ordering, assembly, and bootloader flashing. This board is detailed further in the Projects section below → Demo video is attached.

SKILL PINS
CALIBRATION FIXTURE TESTING VERIFICATION FAILURE ANALYSIS / DEBUGGING SW VALIDATION DOCUMENTATION OPERATING PROCEDURES TEST CASE DATA COLLECTION DOCUMENT CONTROL PCB SCHEMATICS + LAYOUT DEV BOARD BRING-UP
Johnson & Johnson MedTech co-op
Electrical Engineering Co-op
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> PROJECTS.chip / die view

U3 · RESEARCH + BUILD

Contents: 5 sub-components · one presenting at IEEE AP-S this month

4-LAYER DEV BOARD · ATmega32u4

CUSTOM PCB · J&J MEDTECH CO-OP · SPRING 2026

An end-to-end PCB design project in KiCad, taken from block diagram to a working, bootloader-flashed board.

The board is a 4-layer, 2000 × 700 mil ATmega32u4 (7×7 VQFN) dev board. Core blocks: USB-C for power and serial, a voltage regulator feeding the MCU rail, an I²C level shifter into a proximity sensor, NeoPixel LEDs, an oscillator, and a reset button. USB-C was chosen so the board could be powered, programmed, and serial-debugged over a single connector, with the ISP pins (SCK, PDO, PDI, RESET) mapped explicitly before layout.

Layout went through two full revisions after design review, tightening placement and routing around the MCU. From there: wrote the assembly and test plans, ordered parts, hand-assembled the board, inspected the QFN joints under a microscope, verified continuity, and flashed the bootloader.

The board runs a closed-loop demo: the proximity sensor streams distance over I²C, and the firmware maps that reading to NeoPixel brightness in real time.

CORE BLOCKS
ATmega32u4 MCU · 7×7 VQFN USB-C PWR · SERIAL V-REG MCU RAIL OSC RESET LVL SHIFT I²C PROX SENSOR NEOPIXEL
SKILL PINS
KiCad 4-LAYER LAYOUT SCHEMATIC CAPTURE ATmega32u4 / VQFN I²C LEVEL SHIFTING POWER REGULATION USB-C INTERFACE ASSEMBLY / TEST PLANS SMD SOLDERING BOOTLOADER FLASHING FAILURE ANALYSIS
Assembled 4-layer ATmega32u4 dev board with USB-C, red soldermask
Assembled board on breadboard, hand-soldered
DEMO
Proximity sensor output drives NeoPixel brightness · I²C over level shifter

CHOPMATE · ASSISTIVE CUTTING DEVICE

PROJECT MANAGER · FUND. OF ENGINEERING II · JAN – APR 2025

An assistive kitchen device for users with limited hand strength or dexterity. I led the team as project manager and built an Arduino-controlled electromechanical prototype with a 3D-printed gantry that guides and stabilizes the cutting motion.

The design was validated through 80+ usability and safety evaluations, reaching 95%+ approval. Mechanical design and iteration were done in SolidWorks and Onshape, with each revision driven by what testers actually struggled with rather than what we assumed they would.

SKILL PINS
ARDUINO / EMBEDDED CONTROL ELECTROMECHANICAL DESIGN SOLIDWORKS / ONSHAPE 3D PRINTING USABILITY TESTING SAFETY EVALUATION PROJECT MANAGEMENT
ChopMate assistive cutting device: plywood gantry frame with DC-motor drive and joystick control
Gantry frame, motor drive + joystick
Close-up of the ChopMate drive: DC gear motors with wheels on the gantry rail
DC gear-motor drive on the rail
Breadboarded microcontroller and wiring driving the ChopMate motors
Microcontroller + motor-driver wiring

VANTARI · PHOTOBIOMODULATION EARPIECE

HARDWARE DESIGNER · SEP 2024 – JAN 2025

A therapeutic earpiece delivering 500 nm light therapy, where I owned the hardware design. I built a mixed-signal PCB pairing thermal sensing with closed-loop LED driver control, so output could be regulated against measured temperature rather than run open-loop.

Because the device sits against skin, thermal safety was the binding constraint. I ran thermal characterization confirming ΔT ≤ 1°C at the contact surface while still resolving physiologic thermal shifts, which meant the sensing path stayed useful without the device ever becoming uncomfortable.

SKILL PINS
MIXED-SIGNAL PCB ESP32 LED DRIVER CIRCUITS CLOSED-LOOP CONTROL THERMAL SENSING THERMAL SAFETY TESTING EASYEDA PRO LTSPICE

BLUETOOTH ANGLE-BASED VOLUME CONTROLLER

SELF-DIRECTED · ADAFRUIT ITSYBITSY nRF52840 · SUMMER 2025

One of my first breadboarding projects, and the one where the fundamentals clicked. An IMU reads tilt angle on three axes; tilting right sends a VOLUME_INCREMENT and tilting left a VOLUME_DECREMENT, delivered to a phone over Bluetooth as HID commands so the setup appears as a standard Human Interface Device.

Building it taught me the fundamentals I now rely on: I²C between the IMU and the nRF52840, BLE HID over the Adafruit ItsyBitsy nRF52840 Express, and getting two chips to share timing so their data streams stay synchronized. Written in CircuitPython.

SKILL PINS
I²C PROTOCOL BLE HID nRF52840 IMU / TILT SENSING CIRCUITPYTHON BREADBOARD PROTOTYPING
Annotated diagram of the Bluetooth angle-based volume controller: nRF52840, IMU, and BLE HID connection
System annotation: IMU tilt → BLE HID volume commands
DEMO